Verfahren zum Verbinden gegenüberliegender Paare von Detektor- und Auslesemikrochipkontakten in einer Hybriddetektoranordnung.
摘要
Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips (42,44) in a hybrid detector array assembly. The individual tubes (34) of prior art interconnect pads are filled with indium and are then etched away to leave indium columns (40) of increased height, relative to the indium bumps (46) that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.
申请公布号
DE69018713(T2)
申请公布日期
1995.11.16
申请号
DE1990618713T
申请日期
1990.06.22
申请人
HUGHES AIRCRAFT CO., LOS ANGELES, CALIF., US
发明人
HU, WILLLIAM C., CHATSWORTH, CALIFORNIA 91311, US;LONGERICH, ERNEST P., CHATSWORTH, CALIFORNIA 91311, US;D'AGOSTINO, SAVERIO A., CAMARILLO, CALIFORNIA 93010, US