| 摘要 |
<p>Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first (11) and second (31) polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, not intermittently.</p> |
