发明名称 |
SAW device. |
摘要 |
A SAW device includes a SAW element (1) which is fixed onto a base substrate in a face down mode, and a cap which is bonded to the base substrate for enclosing the SAW element. A relation L2 < 3.5 X L3 is satisfied between a center distance L2 between a first input/output electrode 7a which is provided on one side of a region provided with IDTs (5a, 5b) and an input/output electrode (8a) which is provided on another side, and a distance L3 between both outer ends of the IDTs (5a, 5b) along a waveguide path among a plurality of input/output electrodes which are connected to the IDTs (5a, 5b) of the SAW element (1). <IMAGE> |
申请公布号 |
EP0682408(A1) |
申请公布日期 |
1995.11.15 |
申请号 |
EP19950106866 |
申请日期 |
1995.05.05 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MORISHITA, HIDEYA, C/O MURATA MAN. CO., LTD.;NAKASHIMA, KOJI, C/O MURATA MAN. CO., LTD. |
分类号 |
H03H9/145;H03H9/02;H03H9/05 |
主分类号 |
H03H9/145 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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