发明名称 SAW device.
摘要 A SAW device includes a SAW element (1) which is fixed onto a base substrate in a face down mode, and a cap which is bonded to the base substrate for enclosing the SAW element. A relation L2 < 3.5 X L3 is satisfied between a center distance L2 between a first input/output electrode 7a which is provided on one side of a region provided with IDTs (5a, 5b) and an input/output electrode (8a) which is provided on another side, and a distance L3 between both outer ends of the IDTs (5a, 5b) along a waveguide path among a plurality of input/output electrodes which are connected to the IDTs (5a, 5b) of the SAW element (1). <IMAGE>
申请公布号 EP0682408(A1) 申请公布日期 1995.11.15
申请号 EP19950106866 申请日期 1995.05.05
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MORISHITA, HIDEYA, C/O MURATA MAN. CO., LTD.;NAKASHIMA, KOJI, C/O MURATA MAN. CO., LTD.
分类号 H03H9/145;H03H9/02;H03H9/05 主分类号 H03H9/145
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