发明名称 Placement and bonding technique.
摘要 <p>Apparatus (11) is robotically operated to pick up an optical element such as a ball lens (12) or an optical fiber, place it in a groove or depression (13) of a substrate (14), and apply pressure to it so that it is bonded to the substrate. The tool comprises a retracting element holder (17) surrounding a bonding tool (16). A vacuum channel (18) communicates with the element holder so that, by the application of a vacuum, it can pick up an optical element. The tool then moves the element to place it, for example, in a depression (13) of a substrate, whereupon the vacuum is released, thereby to allow the element to nest between opposing sidewalls of the depression. The retracting holder element is simultaneously retracted vertically upwardly so as to expose a bonding surface of the bonding tool. After the element has nested in the groove, the bonding tool contacts the element and forces it against opposite sidewalls to effect a thermo-compression bond of the optical element with the sidewalls. <IMAGE></p>
申请公布号 EP0529953(B1) 申请公布日期 1995.11.15
申请号 EP19920307623 申请日期 1992.08.20
申请人 AT&T CORP. 发明人 NGUYEN, HUNG NGOC
分类号 B23K20/02;B23K33/00;B23P19/00;G02B6/32;G02B6/36;G02B6/42;G02B7/00;G02B7/02;(IPC1-7):B23K33/00 主分类号 B23K20/02
代理机构 代理人
主权项
地址