| 摘要 |
A method and design for packaging electronic chip devices, especially devices intended for radio frequency (RF) and microwave frequencies above 900 MHz is disclosed. An array of metal leads (100) are bonded between two layers of a sheet polymer composite that have been cut to form frames (40, 130) in such a way that the metal leads (100) extend from outside to inside of the single frame shape formed by a pressure and heat bonding step. The polymer composite frame serves the dual purpose of holding the leads in a desired configuration for later assembly and testing steps both inside and outside of its area, and of providing a microwave quality, low insertion loss, low permittivity and electrical insulation function between leads and ground planes. This dual purpose is provided in a uniquely cost-effective way that makes it of particular value for packaging high frequency electronic components intended for the growing consumer and commercial applications market. |
