Packaged semiconductor device and a manufacturing process therefor.

摘要

A method for fabricating a semiconductor device having a resin package, characterized by the steps of: placing an interconnection member having upper and lower major surfaces and carrying a semiconductor chip on one of said upper and lower surfaces said interconnection member further having a conductor pattern in electrical connection to said semiconductor chip, on a jig that has a plurality of support members projecting therefrom and contracting with said interconnection member when said interconnection member is placed on said jig, said plurality of support members being arranged in a predetermined pattern corresponding to said pattern of said interconnection leads; casting a resins on said interconnection member in the state that said interconnection member is held on said jig, such said the semiconductor chip and said interconnection member are embedded in a resin package body; removing said jig from said resin package to form a plurality of depressions in said resin package in correspondence to where said support members of said jig has been contacted; supplying a plurality of terminal members having a spherical form upon said resin package body such that said terminal member settle in said plurality of depressions; and fusing said terminal members to said interconnection member.