| 摘要 |
<p>PURPOSE:To improve the productivity by suppressing the bending of a lead terminal when the semiconductor device is an unconnected one before mounting taking special manhour. CONSTITUTION:This is a semiconductor device where a plurality of lead terminals projecting in line from the periphery of a resin package form J's whose roots lie at the periphery and the outside of the bends on the side of their free ends positioned on the same plane is a connection area connected to external circuits, and lead terminals 511 positioned at both ends of each group of lead terminals 51-1 to 51-4 drawn up at equal pitches within the same row are provided, with tips on the side of their free ends getting in the recesses 32a for positioning of the tips provided at the positions corresponding to the edge of the surface of the resin package body 52. Moreover, other lead terminals 512 excluding the lead terminals 511 positioned at both ends are constituted such that the tips on the side of their free ends contact with or are close to the surface in the positions corresponding to the edge of the surface of the resin package body 52.</p> |
