| 摘要 |
<p>PURPOSE:To remove the wiring on rear side and simplify the disposition and arrangement of planar terminals for external connection, and also, omit an inner-layer wiring, etc., by performing the connection with terminals for external connection each through the through hole provided right above. CONSTITUTION:A wiring circuit 6 made at one main surface of a circuit board 6 is arranged to form the same plane as the one main surface of the circuit board 6. Moreover, a connection 6c is provided in the region to connect the bump 9a for connection arranged on the electrode terminal of a semiconductor chip 9 loaded and mounted. Furthermore, in the circuit board 6, a planar terminal 8 for external connection is led out and exposed to the rear side right below the through hole, through the through hole 7 electrically connected to the wiring circuit 6b on the one main surface. Here, the terminals 8 for external connection are disposed in the shape of a lattice with a regular pitch.</p> |
