| 摘要 |
PURPOSE: To provide a direct image forming method for producing resist patterns with predetermined patterns without using an optical tool on the surface of a base material, such as a printed circuit board. CONSTITUTION: This process for producing the imaging patterns of the resist directly on the base material surface, like the patterns of the etching resistant org. resin material on a copper clad dielectric material in association with the process for producing the printed circuit board(PCB) by using not a photoresist but hot resist, i.e., using a compsn. to be subjected to not photoexcited chemical deformation but heat excited chemical deformation. The film of the hot resist compsn. on the base material surface is scanned by a concentrating heat source, for example, the hot laser released in the IR area, to the desired patterns without the optical tool, by which the localized heat induced chemical deformation of the compsn. is resulted. This deformation directly forms the resist patterns or forms the developable latent image of the patterns in the film. |
