| 摘要 |
<p>PURPOSE:To stabilize hot melt adhesion and improve economy by providing a thermocompression bonding tool, by which molten metal is not stuck to a surface, as well as its manufacturing method. CONSTITUTION:In a thermocompression bonding tool 11 for connecting terminals with inner leads arranged on a semiconductor element, a heat-resisting resin film 15 is formed on a surface 11a of the bonding tool 11. In the manufacturing method for the bonding tool, a silk screen printing technique is used, a stencil having an opening is arranged on the surface 11a, a fluororesin is applied to the surface 11a by rubbing and pushing out the fluororesin through the opening with a squeegee, and the resin is hardened by heating and drying.</p> |
