| 摘要 |
<p>PURPOSE:To perform a suction holding work of a semiconductor wafer efficiently by preventing the flowing in of work liquid between a suction holding surface and a back side of a sample, improving maintainability and suction holding the semiconductor wafer reliably. CONSTITUTION:A suction holding part 17,that is disk shaped, is made of porous ceramic and suction holds a semiconductor wafer 15, is arranged on the upper part of a main device 1, a communication hole 3 is connected with the suction holding part 17, a flat first seal part 18a is arranged to the outer side of the suction holding part 17, a ring shaped groove 5 is arranged to the outer side of the seal part 18a, a second seal part 18b is arranged to the outer side of the ring shaped groove 5 and a communication hole 13 is connected with the ring shaped groove 5.</p> |
