| 摘要 |
PURPOSE:To obtain a multilayer metal-based circuit board which is suitable for a large current capacity and a.large heat-dissipating property and which realizes a high-density interconnection by a method wherein an insulating board in which a printed circuit has been formed on one face and in which a conductive circuit part has been fitted partly is laminated on a metal board via an adhesive so as to be integrated. CONSTITUTION:A printed circuit 2 is formed on one face of an insulating board 4 whose outside size is nearly identical to that of a metal board 1. After the printed circuit 2 has been formed, a part of the insulating board 4 is punched to be a hole in the shape of a conductive circuit, and a conductive circuit part 3 which has been formed by stamping a conductive metal plate is fitted into the punched hole. Then, the insulating board 4 in which the printed circuit 2 and the conductive circuit part 3 have been formed is placed on one face of the metal board 1 via an adhesive layer 5, and both boards are laminated and integrated. Thereby, a multilayer metal-based circuit board is suitable for a large current capacity and a large heat-dissipating property, and a high- density interconnection can be realized. |
