| 摘要 |
PURPOSE:To obtain a multilayer interconnection board which is lightweight and small and whose reliability is enhanced by a method wherein a ground-interconnection layer and a power-supply-interconnection layer are formed of grid-shaped conductors and through-type connection parts between signal-interconnection layers are arranged respectively in nonconductor part regions. CONSTITUTION:A signal-interconnection blank composed of an insulator sheet in which required interconnection patterns and required connection parts are provided on the main face, a ground-interconnection blank 4 composed of layers of grid-shaped conductors 4a in which the length of every side of square clearance pad parts is set at 1mm and in which a grid-shaped conductor width is set at 0.4mm and a power- supply-interconnection blank are prepared. The signal-interconnection raw board, the ground-interconnection blank and the power-supply-interconnection blank are laminated and arranged. Then, a heating treatment and a pressurization treatment are executed to a laminated body, and a multilayer interconnection board is formed. When a solid ground-interconnection blank and a solid power-supply-interconnection blank are used for the multilayer interconnection board instead of the ground- interconnection blank 4 and the power-supply-interconnection blank, its weight becomes light by about 10.% as compared with a multilayer interconnection board constituted under the same condition. |
