发明名称 Micromachined bi-material signal switch
摘要 A micromachined signal switch for vertical displacement includes a fixed substrate having at least one signal line and includes an actuator substrate that is thermally actuated to selectively connect a second signal line to the first signal line. The actuator substrate includes a plurality of legs constructed of materials having sufficiently different coefficients of thermal expansion to create stresses that arc the legs when the legs are subjected to elevated temperatures. In the preferred embodiment, a first material for forming the legs is silicon and a second material is a metal, such as electroplated nickel. A displaceable contact region may be formed integrally with the actuator substrate, but the contact region is preferably a region of an interposer substrate between the fixed substrate and the actuator substrate. The displaceable contact region has a raised position in which the signal line on the fixed substrate is "off" and has a lowered position in which a conductive member on the contact region is positioned to provide electrical communication to the signal line.
申请公布号 US5467068(A) 申请公布日期 1995.11.14
申请号 US19940271811 申请日期 1994.07.07
申请人 HEWLETT-PACKARD COMPANY 发明人 FIELD, LESLIE A.;RUBY, RICHARD C.
分类号 H01H1/00;H01H1/18;H01H1/20;H01H61/04;(IPC1-7):H01H53/00 主分类号 H01H1/00
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