发明名称 |
Resin-packaged electronic component |
摘要 |
A resin-packaged electronic component is provided which comprises an electronic element enclosed in a thermosetting resin package having a mounting face. The resin package is provided with at least one stress concentrating portion extending substantially in parallel to the mounting face and contained in an imaginary plane extending between the electronic element and the mounting face.
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申请公布号 |
US5466887(A) |
申请公布日期 |
1995.11.14 |
申请号 |
US19940294012 |
申请日期 |
1994.08.23 |
申请人 |
ROHM CO. LTD. |
发明人 |
HASEGAWA, MIKI |
分类号 |
H01F27/29;H01G2/02;H01G2/06;H01G2/10;H01G4/224;H01G9/08;H01L23/28;H05K5/00;(IPC1-7):H01L23/28 |
主分类号 |
H01F27/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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