| 摘要 |
<p>PURPOSE: To provide a batch reflow method wherein various kinds of components and a TCP(tape carrier package) are simultaneously soldered to a board. CONSTITUTION: A chip 1 and the other end (i.e., outer lead) of a lead 3 of a TCP connected with an electrode 2 of the chip are fixed by using fixing member 6. Deformation of the outer lead is prevented by using the self weight of the fixing member or thermal deformation, when a board 20 and the outer lead are soldered. As a result, the TCP and other components can be collectively mounted on the board. The quantity of heat generated from the chip can be scattered by using a metal member as the fixing member.</p> |
