| 摘要 |
A device for measuring the thickness of a layer of coating on a metal surface is disclosed. The device includes a housing, a first magnetic probe mounted on the housing for measuring the thickness of the layer on a metal substrate containing iron, and a second eddy current probe mounted on the housing for measuring the thickness of the layer on a metal substrate which does not contain iron. The first and second probes are physically separated from each other on the housing. A calculating circuit receives the output of one of the first and second probes and calculates the thickness of the layer as a function of the output of the one of the first and second probes. A display is coupled to the calculating circuit for displaying the thickness of the layer being measured.
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