| 摘要 |
PURPOSE:To provide sufficient heat resistance for solderability without limiting in shape to a flat plate shape and to inexpensively supply by integrally molding an injection molded piece of thermosetting resin, a base film layer and a conductive circuit. CONSTITUTION:A sheet for a circuit having a base film of a plastic film and a conductive circuit formed on the surface is so set that a base film surface in the sheet is brought into contact with the surface of a cavity of an injection mold to be heated to a suitable temperature by a heat medium, the mold is clamped, and plasticized thermosetting resin is injection molded. A conductive circuit surface of the sheet is disposed at the outside to obtain an injection molded form of the thermosetting resin laminated on the form, the resin molded in the cavity of the mold is formed in a three-dimensional crosslinked structure by thermally setting to provide large heat resistance and excellent properties. |
