| 摘要 |
PURPOSE:To restrain deformation of a block for holding an object to be polished and to polish the object with high flatness. CONSTITUTION:The polishing apparatus comprises a block 34 for holding an object 5 to be polished having double layer structure of disk-like upper and lower plates 34a, 34b bonded each other, a lapping plate 9 disposed on the object 5 holding side of the block 34, mechanism sections 1, 3 for pressing the block 34 against the lapping plate 9, and a mechanism for sliding the block 34 and the lapping plate 9 relatively. Materials for the upper and lower plates 34a, 34b are set such that the difference of thermal expansion per unit length between the upper and lower plates 34a, 34b for the initial temperature will be lower than a predetermined value during the polishing work. |
