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发明名称
DIE BONDING METHOD
摘要
申请公布号
JPH07297209(A)
申请公布日期
1995.11.10
申请号
JP19940084895
申请日期
1994.04.22
申请人
MITSUBISHI ELECTRIC CORP
发明人
HIROTA MIHO
分类号
H01L21/768;H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/768
代理机构
代理人
主权项
地址
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