CERAMIC SUBSTRATE STRUCTURE

摘要

PURPOSE: To provide a pad used for forming soldered connection between a pin and a ceramic plate board in packaging of a micro-electronics semiconductor circuit chip. CONSTITUTION: Since a bonding layer 10 for soldering a pin thereon is formed to have a size smaller than that of a soldering barrier layer 9 provided below the bonding layer 10, a pad has an edge region 13 formed along the circumference of a surface of the soldering barrier layer 9 on which the bonding layer 10 is adhered. This edge region 13 is oxidized to prevent wetting due to a soldering alloy 12 for joining the pin to the pad. The stress in this edge region caused by soldering is reduced, and therefore, generation of crack at the edge of the interface between the pad and a substrate is reduced.