发明名称 IC CARD PRINTED WIRING BOARD
摘要 <p>PURPOSE:To provide an IC card printed wiring board having good connection reliability and environmental resistance of a wire bonding at a low cost. CONSTITUTION:In an IC card printed wiring board, one surface of an insulation substrate has a terminal part 91 and the other surface has a functional part 92, the terminal part 91 is provided with a connection terminal surface 21 and the other functional part 92 is provided with an electronic part mounting hole 93 and a bonding hole 94, and the electronic part mounting hole 93 and the bonding hole 94 are divided from a terminal part side by a copper layer 81 provided to a terminal part side of an insulation substrate 90. In such a printed wiring board, a nickel plating layer 82, a paradium plating layer 11 and a gold plating layer 12 are applied one by one to the surface of the copper layer 81 in the terminal part, the electronic part mounting hole 93 and the bonding hole 94 in layers, respectively.</p>
申请公布号 JPH07297524(A) 申请公布日期 1995.11.10
申请号 JP19940107961 申请日期 1994.04.21
申请人 IBIDEN CO LTD 发明人 HAYASHI NOBUHITO;ADACHI TAKEMA
分类号 B42D15/10;G06K19/077;H05K1/09;H05K3/24;(IPC1-7):H05K3/24 主分类号 B42D15/10
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