发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE: To isolate the other pin through a power supply pin or a ground connection pin even it one pin is mixed with a noise by arranging one of first or second pin while spacing apart from the other pin through the power supply pin or the ground connection pin. CONSTITUTION: The power supply terminals 111, 112 and the ground connection terminals 113, 14 of an internal circuit 104 are arranged on two opposite sides thereof. Consequently, connection can be made to an external connection pin from two opposite sides of the internal circuit 104 without requiring to route the feeder lines 115, 116 for pad and the ground wirings 117, 118 for pad around the entire circumference of the internal circuit 104 at the time of wire bonding the feeder lines 115, 116 for pad and the ground wirings 117, 118 for pad to each frame from two opposite sides of the internal circuit 104. Consequently, the chip size can be reduced correspondingly.
申请公布号 JPH07297353(A) 申请公布日期 1995.11.10
申请号 JP19940091991 申请日期 1994.04.28
申请人 MEGA CHIPS:KK;TOMU DANNSHIN IU 发明人 TAKADA AKIRA;HIKAWA TETSUSHI;SAWADA KOJI;TOMU DANNSHIN IU;FUURON NII
分类号 H01L27/04;H01L21/82;H01L21/822;H01L23/485;H01L23/50;H01L27/10 主分类号 H01L27/04
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