发明名称 METHOD AND MEANS OF TEACHING BONDING COORDINATE
摘要 PURPOSE:To realize reduction of an operation time and improvement of positioning precision by providing an image processing part for calculating a coordinate of each lead part on the basis of input of coordinates of first and second lead parts. CONSTITUTION:When a camera 11 is moved immediately above first and second lead parts by using a manual input means 45 and its coordinate is input, a distance from a lead tip of both leads parts and a deviation amount from a lead width center are calculated by an operational control part 24 of an image processor 20. Then, a coordinate manually input based on the deviation amount is corrected by an operational control part 35 of a device driving part 30 and is stored in a bonding coordinate memory 36 as a new bonding coordinate of each of the first and second lead parts. As for third and following lead parts, a lead part is moved by a difference of another two new bonding coordinates and the operational control part 24 calculates a deviation amount. Then, a coordinate wherein the camera 11 moves is corrected by the operational control part 35 and is stored in the bonding coordinate memory 36 as a new bonding coordinate.
申请公布号 JPH07297223(A) 申请公布日期 1995.11.10
申请号 JP19940110240 申请日期 1994.04.27
申请人 SHINKAWA LTD 发明人 SASANO TOSHIAKI
分类号 H01L21/60;B23K20/00;H01L21/00 主分类号 H01L21/60
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