发明名称 WIRE BONDING METHOD AND DEVICE
摘要 PURPOSE:To automatically correct an offset misregistration and to improve correction precision by automatically driving an XY table to allow a sample detection central axis to move and by detecting misregistration of an impression of a ball or a capillary. CONSTITUTION:Wire bonding is performed for samples one by one. An operation control part 36 moves a sample detection central axis to above an impression of a bonded ball or capillary by an offset correction control memory 35 at the time set at the offset correction control memory 35. Thereby, an impression of a ball or a capillary is imaged by a camera 11. The image is processed by an operation control part 24 of an image processing part 20 and a misregistration amount is calculated. The operation control part 36 of a device driving part 30 corrects an offset amount stored in an offset memory 39 by the calculated misregistration amount.
申请公布号 JPH07297220(A) 申请公布日期 1995.11.10
申请号 JP19940110241 申请日期 1994.04.27
申请人 SHINKAWA LTD 发明人 SASANO TOSHIAKI
分类号 H01L21/60;B23K20/00;H01L21/00;H01L21/607 主分类号 H01L21/60
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