| 摘要 |
<p>PURPOSE:To improve electrical characteristics, by reducing the cost and increasing the capacitance between a power supply and a GND in a semiconductor device of a surface mounting type ceramic package. CONSTITUTION:A metal film 33 formed on a ceramic board 32 is divided into a specified number and formed. Each of the divided metal films 33 is given specified roles, and high dielectric elements 45 are mounted among the sections of the different roles. Each divided metal film 33a, 33b and a semiconductor chip 34 are bonded by wires 42b while bonding is conducted by the power supply-grounding lead wires 42b formed in broad and short size of a lead frame 39, thus forming constitution, in which infer-layer insulation is performed.</p> |
