| 摘要 |
PURPOSE:To realize high density of an inner lead which is a conductor circuit and to provide a semiconductor package with an alignment mark which enables formation of an inner lead over a wide range. CONSTITUTION:An inner lead 2 which is connected with an electrode of a mounted semiconductor chip by wire bonding and is connected with a via hole 4 to form a signal circuit is formed. A part of a conductor circuit 3 formed in the same plane as the inner lead 2 is removed and an alignment mark 1 is formed. |
