| 摘要 |
PURPOSE:To obtain a wiring board excellent in its wiring density and in its insulating reliability, by superimposing metallic foils on the front and rear surfaces of a prepreg having a hole bored previously, and by uniting the foils and the prepreg through pressing and heating, and further, by making the resin of the prepreg flow into the hole and filling the resin into the hole, and thereafter, by forming predetermined wirings thereon. CONSTITUTION:In a prepreg 12 made of glass fabric/polyimide resin, a hole 2 is formed by punching working. Then, on both the surfaces of the prepreg 12, copper foils 11 are laminated, and the prepreg 12 and the foils 11 are united by pressing and heating, and thereby, a connection board 13 is created. In this case, into the hole 2 bored previously in the prepreg 12, the resin of the prepreg 12 is made to flow, and it is filled thereinto. After holes 33 are bored by drilling in the hole part 2 filled with the resin, an electroless copper deposition is applied to the connection board 13, and thereafter, a plating layer 4 is formed on the board 13 by the use of electrolytic copper sulfate plating. Subsequently, resist patterns for etching are formed on the board 13, and wirings 5 are formed thereon by etching, and as a result, a wiring board excelling in its wiring density and in its insulating reliability is obtained. Thereby, a thin wiring board having a high wiring density can be manufactured easily. |
