| 摘要 |
PURPOSE:To provide a cleaning device and a cleaning method of an electrode of a workpiece which enable spot cleaning of an electrode of a substrate before wire bonding, etc. CONSTITUTION:A first probe 4 grounding to electrodes 38, 40 of a substrate 37 and a chip 39 and a second probe 5 which approaches the electrode 38 are provided, a positive voltage is applied to the first probe 4 by a first lead wire 12, and a negative voltage is applied to the second probe 5. Then, discharge is generated between the second probe 5 and the electrode 38 and a stain in a surface of the electrodes 38, 40 is removed by the heat. The removed stain is suck to the inside of the first probe 4 by a vacuum device. Therefore, spot cleaning of the electrodes 38, 40 of the substrate 37 and the chip 39 alone can be realized. |
