| 摘要 |
PURPOSE:To make it possible to achieve mass production and to secure a high reliability and a high yield rate of the mounting of a compact and economical bare chip by removing a part from an assembled plastic molded semiconductor package so as to reserve a required part as a socket. CONSTITUTION:A plastic molded semiconductor package 1 is formed by fixing a semiconductor chip 4 to a tab part 3 of a lead frame 2, connecting the semiconductor chip 4 and the lead frame 2 with a bonding wire 5, thereafter forming a resin molded part 6. The resin molded part 6 is removed from the rear surface side of the semiconductor chip 4. The tab part 3 of the lead frame 2 is removed. The semiconductor chip 4 is further removed. An edge ball part 7 of the bonding wire 5 is 5 is made to remain to serve as the electrode contact part 7 of a socket 8 for a bare chip. Therefore, the electrode 7 for the socket can be provided at a pitch so that wire bonding can be performed, and the extensive narrowing can be achieved. |
