发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PURPOSE:To prevent removed resin burr from sticking a semiconductor element again by providing a punch part for punching out the resin burr of a semiconductor element, by forming the punch part of a plurality of parts divided in an operation direction of the punch part and by changing a stroke of each part. CONSTITUTION:When an outer connection terminal 23 of a semiconductor element 22 with a resin burr is held and the semiconductor element 22 is held, a part positioned above and below the resin burr is provided with a top force 25 and a bottom force 26 with a through hole 24 and a punch part 27 which moves to the through hole 24 and punches out the resin burr. The punch part 27 comprises a part formed to two to four divisions, and each part is made to make a punched surface of the resin burr approximately flat when punched out. Difference of stroke of each part is in an allowable range of 0.3 to 0.5mm and is constituted of two or more kinds of different strokes.
申请公布号 JPH07297215(A) 申请公布日期 1995.11.10
申请号 JP19940089959 申请日期 1994.04.27
申请人 SHARP CORP 发明人 HASEGAWA YASUSHI
分类号 B29C37/02;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C37/02
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