| 摘要 |
PURPOSE:To improve the yield rate and the reliability of a hybrid integrated circuit device for high output power. CONSTITUTION:A heat sink 9, which mounts a power semiconductor device 1 and is connected to a circuit pattern 6 formed on a substrate 5, is formed in an approximately square pattern in a plan view. The pattern is formed so that the heights of a central part 9a, protruding parts 9b formed at the outer edge of the rear surface and the region between the central Part 9a and the protruding parts 9b are the approximately equal heights. The pattern is formed in a slope so that the heights of the central part 9a and parts other than the central part 9a and the region between the central part 9a and the protruding parts 9b become lower toward the outer edge of the bottom surface. Thus, the voids in solder 4 can be strikingly decreased, so that position deviation, rotation deviation and inclination become hard to occur. |
