| 摘要 |
<p>853,987. Making printed circuits; soldering. BLAUPUNKT-WERKE G.m.b.H. Jan. 8, 1957 [Feb. 4, 1956], No. 661/57. Classes 83 (2) and 83 (4). Circuit components are secured to printed circuits by locating, e.g. by cementing or wiring or inserting in a recess, the components on the printed circuit base on the same side as the printed circuits and completely immersing the components in a bath of solder to solder, the terminal portions of the components to the printed. circuits. The printed circuit may be formed as described in Specification 833,000 by adhering a pattern of metal powder to a base and attaching the components as described above, the dip-soldering serving to form the tracks of powder into continuous conductors. The components as described in Specification 3520/57 have terminals at or adjacent their ends and intermediate portions formed of or covered with a heat-resistant or solder-repellant material. The components 2, Fig. 1, are positioned in magazines 1 and are in turn forced by a ram 6 past a detent spring 4 into contact with the printed circuit 7 which has been provided with adhesive in appropriate places. In a modification the components 2, Fig. 2, are transferred from magazines 16 by a suction device 11 which deposits them on a prepared printed circuit 7. The assemblies are then dip-soldered.</p> |
