Solder system for soldering surface-mountable components on circuit boards.

摘要

The solder system has at least one controlled-temperature soldering bracket (7) which is supported (by means of magnetic forces) in a floating manner in a holding device (8, 9) with respect to the position of the contact surface (6) of said soldering bracket to the surface of the printed-circuit board, in such a manner that the contact surface (6) of the soldering bracket (7) is automatically aligned to the surface of the printed-circuit board.