发明名称 |
A printed wire board assembly. |
摘要 |
<p>A printed wiring board having electronic circuit devices (13, 44) such as semi-conductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board. <IMAGE></p> |
申请公布号 |
EP0681422(A2) |
申请公布日期 |
1995.11.08 |
申请号 |
EP19950302723 |
申请日期 |
1995.04.24 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
REDDY, PRATHAP AMERWAI;BAKER, JAY DEAVIS;SALISBURY, KENNETH ALAN;TRUBLOWSKI, JOHN |
分类号 |
H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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