Mold for a semiconductor package

摘要

A mold for a semiconductor package having a port 4 for feeding resin 3 which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip 7 so that the operating rate of the equipment is increased to achieve high productivity. There is an upper centre block 5 having a runner as a feeding passage for resin 3 and for preventing a counter current of resin. A port fixing block 6 is alternately fixed either in mould 1 by clamping means or in mould 2 securely fixed in a moving plate corresponding to location of flange tip 7.