发明名称 Chip-in-glass fluorescent indicator panel with heat protection
摘要 A chip-in-glass fluorescent indicator panel includes a glass substrate, a wiring layer, an insulating layer, a pattern-like graphite layer, a phosphor layer, a filament, a grid, an IC, an IC shield, a filament fixing portion, and an anchor. The wiring layer is formed on the glass substrate. The insulating layer covers the wiring layer. The pattern-like graphite layer is formed on the insulating layer to be electrically connected to the wiring layer. The phosphor layer is formed on the pattern-like graphite layer. The filament is suspended above phosphor layer with an interval. The grid is arranged between the filament and the phosphor layer. The IC is fixed on the insulating layer on one end side of the glass substrate to be connected to the pattern-like graphite layer through the wiring layer. The IC shield is arranged between the IC and the filament. The filament fixing portion is formed on the IC shield. The anchor is arranged on the insulating layer on the other end side of the glass substrate to suspend the filament between the anchor and the filament fixing portion.
申请公布号 US5465027(A) 申请公布日期 1995.11.07
申请号 US19930056296 申请日期 1993.04.30
申请人 NEC CORPORATION 发明人 ISHIZUKA, MITSUHIRO;SAEKI, HIROSHI
分类号 H01J29/96;H01J31/15;(IPC1-7):H01J1/88 主分类号 H01J29/96
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