| 摘要 |
PURPOSE:To provide a composition and dewaxing method in which crack, blister and deformation are not generated in a molding and an organic binder is removed from the molding. CONSTITUTION:In a process in which after as a binder for powder molding, a composition for powder molding contg. a photodegradation resin having both photolysis and thermoclosslinking function is used and molded into a desired shape, the photodegradation resin is removed from the moldings, the photodegradation resin in a light-irradiated part iis made a low molecular weight component by photolysis and the component is eluted and removed with an organic solvent or water solution sufficient to dissolve it at a temp. sufficient to remove it or to easily volatilize and remove it. The photodegradation resin in an unirradiated part is strengthened by closslinking reaction by heating to provide a deformation preventive function. After that, it is decomposed and removed by heating at not less than thermal decomposition temp. In this way, a composition for powder molding excelling in storage stability of a compound is provided. |
