| 摘要 |
A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect the pressure exerted by the cooling apparatus on the chip. A block is provided with a plurality of holes, and cooling members are inserted in these holes. An elastic member is provided between the block and the cooling member, and the cooling member is supported in the block by the elastic member. Each of the cooling members are connected by pipes, and a bellows is provided in the pipe. When the block is loaded on the substrate on which the integrated circuit chips are mounted, the elastic member deforms and the cooling member is displaced in accordance with the height and inclination of the integrated circuit chip. The lower surface of the cooling member is brought into close contact with the integrated circuit chip due to the deformation of the elastic member. The bellows deforms in accordance with the displacement of the cooling member to ensure the normal connection of the pipe. When the coolant is supplied through a nozzle into the cooling member, the expanded bellows pushes the pipe up but does not push the cooling member down since the nozzle is fixedly secured in the cooling member.
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