IC-Chipstruktur.

摘要

A structure of semiconductor IC (Integrated Circuit) chip carrier feasible for a multi-terminal arrangement and high-speed signal propagation. Input/output terminals in the form of pins (50a) or bumps are directly provided on the circuit surface of an IC chip (50) to serve as the leads of a chip carrier. A heat spreader (52) is soldered (54) or otherwise affixed to the rear of the IC chip and plays the role of the body of the chip carrier. The IC chip itself may be buried in the heat spreader by a seal resin (56).