| 摘要 |
Disclosed is a heat-sensitive stencil sheet having its perforating and separating properties in the case of doing stencil-making by thermal heads and not allowing a releasing layer thereof to transfer to the other stencil sheet even in the case of stacking the heat-sensitive sheet to each other. The heat-sensitive stencil sheet comprises a porous substrate, a thermoplastic resin film laminated thereon with an adhesive, and a releasing layer provided on the thermoplastic resin film, wherein the releasing layer mainly consists of silicone phosphate. |
