发明名称 THERMOSETTING COMPOSITION, MOLDING MATERIAL, MOLDED STRUCTURE, AND METHOD OF DECOMPOSING THEM
摘要 <p>A thermosetting composition which comprises an unsaturated polyester, and addition-polymerizable monomer, a shrinkage reducing agent other than aliphatic polyesters, and an aliphatic polyester, and which can be decomposed, after being set, by a decomposing solution containing a base and at least one solvent selected from the group consisting of water, methanol, ethanol and ethylene glycol at a temperature lower than the boiling point of the solution.</p>
申请公布号 WO9529205(A1) 申请公布日期 1995.11.02
申请号 WO1995JP00816 申请日期 1995.04.26
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TERADA, TAKAHIKO;ONISHI, HIROSHI 发明人 TERADA, TAKAHIKO;ONISHI, HIROSHI
分类号 C08L63/00;C08L67/06;H02K5/02;H02K15/00;(IPC1-7):C08L67/02;C08L67/04;C08F283/01;H02K5/08;C08L101/00 主分类号 C08L63/00
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