| 摘要 |
The composition of the invention comprises hydrogen peroxide, at least one surface active agent, at least one peroxide stabilizing agent, at least one evaporation retarder, at least one adhesiveness enhancing agent and at least one anticorrosion agent or a sequestering agent, and provides, at the time of use, 10-20,000 ppm of hydrogen peroxide. The composition can also contain other conventional compatible fungicides. The invention also concerns a sporicide-fungicide made from said composition and a method of treating plants with said sporicide or said composition. The invention provides a formulation for combatting the spores and mycelium of numerous parasitic fungi more effectively than non-formulated hydrogen peroxide. |
