| 摘要 |
A lead frame for facilitating assembly and interconnection of a plurality of integrated circuit chips comprises a pattern of planar conductors including a surrounding outer connecting strip to which other conductors are temporarily joined, said outer connecting strip having an open end and a closed end. The other conductors comprise a plurality of chip mount conductive areas, each for mounting one of a plurality of chips, disposed in a fan-like arrangement adjacent to the closed end of said outer connecting strip and each connected to said outer connecting strip by a respective tie bar. The other conductors further comprise a plurality of common leads disposed in a semicircular pattern within the fan-like arrangement of the conductive areas, each adapted for connection to selected electrodes of said plurality of chips and a first plurality of parallel external leads drawn out from said common leads arranged in a row, all of said external leads being temporarily connected together and to said outer connecting strip by a common tie bar extending across the open end of said outer connecting strip. |
