| 摘要 |
This invention relates to a method of mounting and electrically conductive interconnecting of electronic - especially microelectronic semiconductor - components by means of solderbumps on substrates and of substrates on constituents, which are part of a component housing or of another component containing construction, and products made according to this method comprising (being characterized by) a pressure force creating device (8), exerting a permanent pressure on the touching areas of the solderbumps (4) with the interconnection pads (2) of conductor patterns, and a deformable electrical conducting material (5) which is present on at least one of these touching areas. The permanent pressure force creating mechanism is incorporated in or is a part of the housing of one or more components. The solderbumps can be a part of the component or a part of the substrate. |
