| 摘要 |
PURPOSE:To reduce the formation of a plating film on a treating vessel by providing plural upper vessels corresponding to the processing solns. to be applied when the treating vessel is formed by combining the lower vessel provided with a substrate and the upper vessel through a sealing member. CONSTITUTION:The substrate 5 is provided on a treating cup receiver 8, arranged on a turntable, moved directly below a treating cup 9 by rotating the turntable, and combined with the cup 9 through the sealing member 83 to form the treating vessel 1. The substrate 5 is washed with pure water in the treating vessel 1, a liq. light etchant is supplied to etch the surface of the substrate 5, and the substrate is again washed with pure water. The cup 9 is then elevated and unbound, the receiver 8 is successively moved to the succeeding cup 9 to form a treating vessel 1, water washing, sensitization, activation, and Ni plating are applied, and a plating film is formed. As a result, the formation of a plating film on the cup 9 is prevented, and the plating cost is reduced. |
