摘要 |
PURPOSE: To mutually bond conductively coated polymer substrates in a single step, by coating a conductive layer on the substrates, mutually contacting points for forming mechanical and electrical bonds, and applying a directed energy to the substrates to melt the conductive layers and substrates. CONSTITUTION: A conductive coating 30 for forming electric bonds is applied to substrates at two mutually fitting parts 10, 20 fine tongue parts 50 are formed at mechanical bond-forming parts, and energy detector 40 is provided at a part thereof. A groove 70 of the part 10 is contacted to the fine part 50, and a directional energy is applied to melt the coating 30 and polymer substrates, thereby mutually bonding the substrates having the coating 30 in a single step. |