发明名称 STRUCTURE AND METHOD FOR FORMING ELECTRIC/MECHANICAL JOINT
摘要 PURPOSE: To mutually bond conductively coated polymer substrates in a single step, by coating a conductive layer on the substrates, mutually contacting points for forming mechanical and electrical bonds, and applying a directed energy to the substrates to melt the conductive layers and substrates. CONSTITUTION: A conductive coating 30 for forming electric bonds is applied to substrates at two mutually fitting parts 10, 20 fine tongue parts 50 are formed at mechanical bond-forming parts, and energy detector 40 is provided at a part thereof. A groove 70 of the part 10 is contacted to the fine part 50, and a directional energy is applied to melt the coating 30 and polymer substrates, thereby mutually bonding the substrates having the coating 30 in a single step.
申请公布号 JPH07288268(A) 申请公布日期 1995.10.31
申请号 JP19950039505 申请日期 1995.02.28
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 JIYOOJI MAIKERU JIYORUDAAMO;RUI HARII UIRUTSU
分类号 H01L21/607;B29C65/00;B29C65/08;H05K1/11;H05K3/32;H05K3/36;H05K3/40;H05K3/46 主分类号 H01L21/607
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