| 摘要 |
<p>PURPOSE:To reduce the amount of dust generation giving the adverse effect on a semiconductor wafer by forming one of a pair of linking plates of a wafer carrier so that the area at the lower part becomes small. CONSTITUTION:In a wafer carrier 10, a pair of linking plates 13a and 13b are provided. One linking plate 13a faces the surface of a semiconductor wafer, and the other linking plate 13b faces the rear surface of the semiconductor wafer. The wafer is supported with supporting rods 11a and 11b through a pair of the linking plates 13a and 13b. Cutouts 14 having the convex curved surfaces are formed at the lower parts of a pair of the linking plates 13a and 13b, and the areas of the lower parts of a pair of the linking plates 13a and 13b are made small. Thus, the amount of dust generation giving the adverse effect on the semiconductor wafer can be made small.</p> |
