| 摘要 |
PURPOSE:To follow up irregularities of other substrates, to restrain generation of voids and also to restrain flow-out of resin even if a thickness of an adhesive layer becomes 60mum or less by arranging a polyethylene sheet and a laminating release film whose thermal softening temperature is specific between a stainless plate and a substrate as a cushion material and by laminating and bonding them. CONSTITUTION:An adhesive film layer is provided to a roughening treatment surface of a printed wiring board copper foil 3 and the film is pressurized and heated to form a B stage. A hole is shaped in a necessary place of a substrate. The substrate is laminated in contact with the adnesive layer side of another bored substrate, and is made integral by lamination by heating and pressurizing. In the process, a polyethylene sheet 6 and a lamination release film 2 whose thermal softening temperature is between 40 and 130 deg.C are arranged between the stainless plate 1 and the wiring layer substrate 5. Then, the polyethylene sheet is softened and fused, polyethylene follows up irregularities and holes of other substrates and an entire of a substrate surface can be uniformly laminated and bonded. |
