发明名称 Method for mounting electronic component on a flexible printed circuit board
摘要 A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.
申请公布号 US5461775(A) 申请公布日期 1995.10.31
申请号 US19940230033 申请日期 1994.04.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TANABE, KOUJI;NISHIOKA, NAOHIRO
分类号 H05K3/28;H05K1/00;H05K1/09;H05K1/11;H05K1/18;H05K3/24;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K3/34 主分类号 H05K3/28
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